High resistive buffer layers by Fermi level engineering

نویسندگان

چکیده

An efficient carrier compensation mechanism in semiconductor layers by Fermi-level engineering is demonstrated using the modulation-doping of a deep acceptor and shallow donor. The punch-through depletion region across whole stack modulation-doped shifts Fermi level closer toward midgap position, resulting residual background free carriers. method represents an alternative to achieve semi-insulating properties materials where suitable or donor state at position not available. We demonstrate applicability concept with commercially important GaN case study carbon (deep acceptor) Si (shallow donor) doping. A strong enhancement breakdown field strength reduced charge pileup effects are observed due pinning level.

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ژورنال

عنوان ژورنال: Journal of Applied Physics

سال: 2023

ISSN: ['1089-7550', '0021-8979', '1520-8850']

DOI: https://doi.org/10.1063/5.0160242